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General Information
    • ISSN: 1793-8198
    • Frequency: Quarterly
    • DOI: 10.18178/IJMMM
    • Editor-in-Chief: Prof. K. M. Gupta, Prof. Ian McAndrew
    • Executive Editor: Ms. Cherry L. Chen
    • Abstracting/Indexing: EI (INSPEC, IET), Chemical Abstracts Services (CAS), Engineering & Technology Digital Library,  ProQuest, Crossref, Ulrich's Periodicals Directory, DOAJ, and Electronic Journals Library .
    • E-mail ijmmm@ejournal.net
Editor-in-chief
Prof. Ian McAndrew
Embry Riddle Aeronautical University, UK.
It is my honor to be the editor-in-chief of IJMMM. I will do my best to help develop this journal better.

IJMMM 2013 Vol.1(3): 283-286 ISSN: 1793-8198
DOI: 10.7763/IJMMM.2013.V1.60

Effect of Sintering Parameters on Microstructure and Properties of Mechanically Alloyed Copper-Tungsten Carbide Composite

Mahani Yusoff and Zuhailawati Hussain
Abstract—In this study, copper-tungsten carbide composite was produced by mechanical alloying and powder metallurgy. The effect sintering temperature and time (800°C to 1000°C and 1 to 3 h) on composite microstructure and properties were investigated. The results showed that WC is formed at lower temperature and the presence of WC favoured the enhancement of the properties of the composite. The increased both hardness and electrical conductivity has been observed with the increase sintering temperature.

Index Terms—Copper-based composite, mechanical alloying, sintering.

Mahani Yusoff is with Faculty of Earth Science, Universiti Malaysia Kelantan, Jeli Campus, Locked Bag 100, 17600 Jeli, Kelantan, Malaysia (e-mail: mahani@umk.edu.my).
Zuhailawati Hussain is with School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia. (e-mail: zuhaila@eng.usm.my).

[PDF]

Cite:Mahani Yusoff and Zuhailawati Hussain, "Effect of Sintering Parameters on Microstructure and Properties of Mechanically Alloyed Copper-Tungsten Carbide Composite," International Journal of Materials, Mechanics and Manufacturing vol. 1, no. 3, pp. 283-286, 2013.

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